Lift tool assembly for stencil printer

ABSTRACT

A stencil printer includes a frame, a stencil coupled to the frame, and a print head coupled to the frame to deposit and print viscous material over the stencil. The stencil printer further includes a lift table assembly configured to support the substrate in a transport position and a print position, and a conveyor system. The conveyor system includes a pair of rail members coupled to the frame. The pair of rail members extends through the frame and is configured to transport the substrate through the stencil printer. The conveyor system further includes, for each rail member, a lift tool assembly coupled to the rail member. The lift tool assembly is configured to cooperate with the lift table assembly and to engage and support the substrate at a transport height and a print height.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is a divisional patent application of U.S.patent application Ser. No. 14/680,359 filed on Apr. 7, 2015, entitled,“LIFT TOOL ASSEMBLY FOR STENCIL PRINTER,” which is hereby incorporatedby reference in its entirety for all purposes.

BACKGROUND OF THE DISCLOSURE

1. Field of Invention

The present invention relates generally to stencil printers, and moreparticularly to a lift tool assembly designed to manipulate anelectronic substrate, such as a printed circuit board, while performinga stencil printing operation.

2. Discussion of Related Art

In manufacturing a surface-mount printed circuit board, a stencilprinter can be used to print solder paste onto the circuit board.Typically, a circuit board having a pattern of pads or some otherconductive surface onto which solder paste will be deposited isautomatically fed into the stencil printer; and one or more small holesor marks (known as “fiducials”) on the circuit board are used toproperly align the circuit board with the stencil or screen of thestencil printer prior to printing solder paste onto the circuit board.In some systems, an optical alignment system embodying a vision systemis used to align the circuit board with the stencil.

Once the circuit board has been properly aligned with the stencil in theprinter, the circuit board is raised to the stencil, solder paste isdispensed onto the stencil, and a wiper blade (or squeegee) traversesthe stencil to force the solder paste through apertures in the stenciland onto the circuit board. As the squeegee is moved across the stencil,the solder paste tends to roll in front of the blade, which desirablycauses mixing and shearing of the solder paste so as to attain a desiredviscosity to facilitate filling of the apertures in the screen orstencil. The solder paste typically is dispensed onto the stencil from astandard cartridge. The stencil is then separated from the circuit boardand the adhesion between the circuit board and the solder paste causesmost of the material to stay on the circuit board. Material left on thesurface of the stencil is removed in a cleaning process beforeadditional circuit boards are printed.

Another process in the printing of circuit boards involves inspection ofthe circuit boards after solder paste has been deposited on the surfaceof the circuit boards. Inspecting the circuit boards is important fordetermining that clean electrical connections can be made. An excess ofsolder paste can lead to shorts, while too little solder paste inappropriate positions can prevent electrical contact. Generally, thevision inspection system is further employed to provide atwo-dimensional or a three-dimensional inspection of the solder paste onthe circuit board.

The stencil cleaning process and the circuit board inspection processare merely two of a number of processes involved in producing circuitboards. To produce the greatest number of circuit boards of consistentquality, it is often desirable to reduce the cycle time necessary tomanufacture circuit boards, while maintaining systems that ensure thequality of the circuit boards produced, such as the circuit boardinspection and stencil cleaning systems.

SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure is directed to a stencil printerfor printing viscous material on a substrate. In one embodiment, thestencil printer comprises a frame, a stencil coupled to the frame, aprint head, coupled to the frame, to deposit and print viscous materialover the stencil, a lift table assembly configured to support thesubstrate in a transport position and a print position, and a conveyorsystem. The conveyor system includes a pair of rail members coupled tothe frame. The pair of rail members extends through the frame and isconfigured to transport the substrate through the stencil printer. Theconveyor system further includes, for each rail member, a lift toolassembly coupled to the rail member. The lift tool assembly isconfigured to cooperate with the lift table assembly and to engage andsupport the substrate at a transport height and a print height.

Embodiments of the stencil printer further may include configuring thelift tool assembly to engage and support a substrate at a vision systemclearance height. The lift tool assembly may include a lifter portionconfigured to be engaged by a support of the lift table assembly. Thelifter portion may include a foot that extends under the rail member,with the foot being configured to be engaged by the support of the lifttable assembly. The foot of the lifter portion may contain permanentmagnets to couple to the support of the lift table assembly. The lifttool assembly further may include a modular clamping subassembly coupledto the lifter portion. The modular clamping subassembly may include abackplane mounted on a top of the lifter portion. The backplane may havea linear bearing mounted on a back of the backplane to provide a degreeof freedom for clamping. The modular clamping subassembly further mayinclude an L-shaped plate mounted on the linear bearing. The L-shapedplate may be configured with a clamping assembly on which flexible steelfoils clamp substrate. A clamping force on the substrate may be providedby several pneumatic cylinders. The backplane of the modular clampingsubassembly may include a pin configured to be positioned within alocator associated with the rail member.

Another aspect of the disclosure is directed to a method for supportingand clamping a substrate in a print position during a print operation ofa stencil printer. In one embodiment, the method comprises: moving thesubstrate on a conveyor system having a pair of rails at a transportheight over a lift table assembly; clamping opposite edges of thesubstrate; and moving the substrate in a z-axis direction with a lifttool assembly coupled to each rail member.

Embodiments of the method further may include locating a pin associatedwith the lift tool assembly into a locator associated with the railmember when moving the substrate to the transport height position.Moving the substrate in the z-axis direction may include engaging thelift tool assembly with a support of the lift table assembly. Thesubstrate may be configured to move between a transport height position,a vision system clearance height position and a print height position.

Another aspect of the disclosure is directed to a conveyor system for astencil printer of the type to print viscous material on a substrate. Inone embodiment, the conveyor system comprises a pair of rail memberscoupled to the frame. The pair of rail members extends through the frameand is configured to transport the substrate through the stencilprinter. For each rail member, a lift tool assembly is coupled to therail member. The lift tool assembly is configured to cooperate with thelift table assembly and to engage and support the substrate at atransport height, a vision system clearance height and a print height.

Embodiments of the conveyor system further may include constructing thelift tool assembly with a lifter portion configured to be engaged by asupport of the lift table assembly. The lifter portion may have a footthat extends under the rail member. The foot may be configured to beengaged by the support of the lift table assembly. The lift toolassembly further may include a modular clamping subassembly coupled tothe lifter portion, the modular clamping subassembly having a backplanemounted on a top of the lifter portion. The backplane may have a linearbearing mounted on a back of the backplane to provide a degree offreedom for clamping.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are not intended to be drawn to scale. In thedrawings, each identical or nearly identical component that isillustrated in various figures is represented by a like numeral. Forpurposes of clarity, not every component may be labeled in everydrawing. In the drawings:

FIG. 1 is a front perspective view of a stencil printer of an embodimentof the present disclosure with external packaging removed to reveal theprimary operating systems of the stencil printer;

FIG. 2 is a perspective view of a conveyor system of the stencilprinter;

FIG. 3 is a perspective view of a rail member of the conveyor system;

FIG. 4 is a perspective view of the rail member shown in FIG. 3 having alift tool assembly of an embodiment of the disclosure provided on therail member, with the lift tool assembly being shown at a transportheight;

FIG. 5 is a cross-sectional view of the lift tool assembly;

FIG. 6 is a cross-sectional view of the conveyor system with the lifttool assembly being shown at the transport height;

FIG. 7 is a perspective view of the conveyor system with the lift toolassembly being shown at a vision system inspection height;

FIG. 8 is a perspective view of the conveyor system with the lift toolassembly being shown at a print height; and

FIG. 9 is an exploded perspective view of the lift tool assembly havingone of a foil clamping system and a customized board clamping system.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present disclosure relates generally to material applicationmachines (referred to herein as “stencil printers,” “screen printers,”“printing machines,” or “printers”) and other equipment utilized in asurface mount technology (SMT) process lines and configured to apply anassembly material (e.g., solder paste, conductive ink, or encapsulationmaterial) onto a substrate (e.g., a printed circuit board, referred toherein as an “electronic substrate,” a “circuit board,” a “board,” a“PCB,” a “PCB substrate,” a “substrate,” or a “PCB board”) or to performother operations, such as inspection, rework, or placement of electroniccomponents onto a substrate. Specifically, embodiments of the presentdisclosure are described below with reference to stencil printers usedto produce printed circuit boards.

Referring now to the drawings, and more particularly to FIG. 1, there isgenerally indicated at 10 a stencil printer of an embodiment of thedisclosure. As shown, the stencil printer 10 includes a frame 12 thatsupports components of the stencil printer. The components of thestencil printer 10 includes, in part, a conveyor system, generallyindicated at 14, a stencil shuttle assembly, generally indicated at 18,and a print head assembly or print head, generally indicated at 20,which together are configured to apply viscous materials, includingsolder paste, in a manner described in greater detail below. The stencilshuttle assembly 18 includes a stencil, which is not shown in FIG. 1 forthe purpose of improving clarity.

The stencil printer 10 further includes a lift table assembly, generallyindicated at 22, which includes a support surface 24 that is configuredto raise a circuit board 16 delivered by the conveyor system 14 from alower transport position in which the circuit board lies along the sameplane as the conveyor system 14 to a raised or print position in whichthe circuit board engages the stencil. The lift table assembly 22 isfurther configured to lower the circuit board 16 from the print positionback to the lower transport position. The stencil printer 10 further mayinclude a controller 26 and a keyboard and a display (not shown) toenable an operator or assembly system to control the operation of thestencil printer.

Referring to FIG. 2, the conveyor system 14 of the stencil printer 10includes two transport rail members, generally indicated at 28, 30, totransport the printed circuit board 16 to and from the lift tableassembly 22 of the stencil printer. The transport rail members 28, 30sometimes may be referred to as a “tractor feed mechanism,” whichtogether are configured to feed, load or otherwise deliver circuitboards to the working area of the stencil printer 10, which may bereferred to herein as a “print nest,” and to unload circuit boards fromthe print nest.

Each transport rail member 28, 30 include a board lifter or lift toolassembly, generally indicated at 32, which is configured to engage andsupport the edges of the circuit board 16 during a print operation. Eachtransport rail member 28, 30 further include a motor 34 and a transportbelt 36 coupled to the motor. The arrangement is such that the motors 34of the transport rail members 28, 30 drive the synchronized movement ofthe transport belts 36 to move the circuit board 16 to and from theprint nest under the control of the controller 26.

Referring additionally to FIG. 3, which illustrates the transport railmember 28 without the lift tool assembly 32, each transport rail member28, 30 further includes a pair of rail mounts, each indicated at 38,which connect the transport rail members to the frame 12 of the stencilprinter 10, and a board guide 40, which is configured to guide thecircuit board along the transport rail member when conveying the circuitboard 16. Each transport rail member 28, 30 also includes a sensor 42 todetect when a new circuit board enters the stencil printer 10.

The lift tool assembly 32 is configured cooperate with the supportsurface 24 of the lift table assembly 22 to engage and support thecircuit board 16 at a transport height, a vision system clearanceheight, and a print height, which will be described in greater detailbelow. The lift tool assemblies 32 of embodiments of the presentdisclosure are provided to lift and clamp the circuit board 16independent of the transport rail members 28, 30 of the conveyor system14 while the circuit board is at the vision system clearance height andthe print height. As referenced above, the lift tool assemblies 32 canachieve a desired fixed z-axis (up/down) height. By decoupling the lifttool assemblies 32 from the transport rail members 28, 30 at a workingheight makes the lift tool assemblies dependant on the lift tableassembly 22 position and eliminates influence and interaction from asecond source, such as the transport rail members. Precise andrepeatable positioning of the lift tool assemblies 32 provides theoperator of the stencil printer 10 with the ability to print featureswith smaller dimensions and finer pitch with less waste. The lift toolassemblies 32 of embodiments of the present disclosure fit around theirrespective stationary transport rail members 28, 30. In a certainembodiment, the lift tool assemblies 32 can achieve one of three z-axis(height) positions; however, any desired z-axis height may be achieved.

Referring additionally to FIGS. 4 and 5, each lift tool assembly 32includes a lifter portion, generally indicated at 44, which isconfigured to be engaged by the support surface 24 of the lift tableassembly 22, and a modular clamping subassembly, generally indicated at46, coupled to the lifter portion. As shown, the lifter portion 44 isgenerally L-shaped member including a horizontally extending foot 48that extends under the transport rail member 30 and the modular clampingsubassembly 46, and vertically extending arm 50 that extends upwardly atan edge of the foot. The foot 48 includes a bottom surface 52 that facesthe support surface 24 of the lift table assembly 22. As shown, thebottom surface 52 of the foot 48 includes several standoffs, eachindicated at 54, which are configured to be engaged by the supportsurface 24 of the lift table assembly 22. In one embodiment, eachstandoff 54 of the foot 48 is configured to contain a permanent magnetto more firmly secure the support surface 24 of the lift table assembly22 to the lift tool assembly 32.

The modular clamping subassembly 46 includes a backplane 56 mounted on atop surface 58 of the foot 48 of the lifter portion 44. As shown, thebackplane 56 has a linear bearing 60 mounted on a back of the backplane56 to provide a degree of freedom for clamping. The modular clampingsubassembly 46 further includes an L-shaped plate 64 mounted on thelinear bearing 60 of the backplane 56. The L-shaped plate 64 isconfigured with a clamping assembly generally indicated at 66 on whichflexible steel foils clamp substrate. As shown, the clamping assembly 66includes a clamping member 68 having a vertical surface that engages anedge of the circuit board 16 and a thin foil 70 disposed above theclamping member. As shown, the thin foil 70 extends horizontally fromthe clamping member 68. The clamping assembly 66 further includesseveral pneumatic cylinders, each indicated at 72, which are designed tomove the L-shaped plate 64 to apply a clamping force on the circuitboard 16 during operation. To ensure that the lift tool assembly 32 ispositioned correctly with respect to its respective transport railmember 30, the backplane 56 of the modular clamping subassembly 46includes several location pins, each indicated at 74, that areconfigured to be positioned within respective locators, each indicatedat 76, associated with the transport rail member. The locator pins 74are designed to fit within respective openings provided in the locators76.

To achieve a desired transport height, the lift tool assembly 32 waitsfor a circuit board 16 to be loaded from a left/right position to centerof the stencil printer 10. In this neutral, non-operational position,the location pins 74 and the locators 76 set/reset the position of thelift tool assembly 32 with respect to the transport rail member 28 or 30with every circuit board 16 to an approximate position to accept a newcircuit board.

To achieve a vision system clearance height, after the circuit board 16has been positioned, the support surface 24 of the lift table assembly22 moves upward to engage the foot 48 of the lifter portion 44 of thelift tool assembly 32, at which time the pneumatic cylinders 72 of theclamping assembly 66 clamp the circuit board. At a z-axis positionsuitable for a vision system of the stencil printer 10 to travel betweenthe circuit board 16 and the lift table assembly 22, referred to hereinas the vision system clearance position, the locating pins 74 of thetransport rail members 28, 30 are no longer in contact with theirrespective locators 76 of the lift tool assembly 32. In this position,there is sufficient clearance between lift tool assembly 32 and thetransport rail members 28, 30 so there is no contact, interference orinfluence from the transport rail members imparted on the lift toolassembly.

To achieve a print height from the vision system clearance heightposition, the lift tool assembly 32, which is magnetically coupled tothe lift table assembly 22, moves upwardly to the print height position.Contact between lift tool assembly 32 and transport rail members 28, 30remains decoupled, which eliminates influence from transport railmembers.

FIG. 6 illustrates the lift tool assembly 32 supporting the circuitboard 16 at the transport height at which the circuit board istransported into the stencil printer 10. FIG. 7 illustrates the lifttool assembly 32 supporting the circuit board 16 at the vision systemclearance height at which the vision system is configured to movebetween the circuit board and the stencil to align the circuit boardwith the stencil. And FIG. 8 illustrates the lift tool assembly 32supporting the circuit board 16 at the print height at which a printoperation takes place.

Once a print operation is complete, the circuit board 16 returns to thetransport height for loading/unloading circuit boards.

Possible variations of the lift tool assembly 32 may include but is notlimited to varying a length of the lift tool assembly. In oneembodiment, the lift tool assembly 32 is 400 millimeters in length. Avariety of circuit board thicknesses can be accommodated.

In addition to passive foil clamping, the backplane can be removable toprovide for active clamping in the form of another clamping mechanism,such as an EDGELOC™ board clamping system, making the lift tool assemblymodular and with the ability to be modified in the field. FIG. 9illustrates the lifter portion 44 spaced from a modular clampingassembly 46 embodying the modular clamping subassembly 46 embodying thefoil clamping assembly 66. However, another modular clamping assembly,generally indicated at 80, such as the EDGELOC™ board clamping system,may be used in place of the modular clamping assembly 46.

Advantages of the lift tool assembly over the previous designs includebut are not limited to the decoupling of lift tool assembly from itsrespective transport rail member for more precision and repeatability inprocess. Modularity and the ability to alternately switch from thepassive foil clamping system to the active EDGELOC™ board clampingsystem and back to enhance to customers ability to customize processes.Because the transport rail members are stationary in the z-axis(height), circuit boards can be staged prior to the lift tool assembly.

It should be observed that the conveyor system embodying the lift toolassembly is capable of handling the circuit boards inside the stencilprinter. This consists of loading, printing, and unloading of circuitboards.

Each transport rail member is divided roughly into three equal sections.The left and right sections of each rail member are mirrors of eachother, capable of handling the loading and unloading of boards. Thecenter section of each transport rail member is where the circuit boardis aligned for printing and moved in an upward direction for printing.The center section of the transport rail member having the lift toolassembly is moved upward by the lift table assembly, or other suitablelifting platform. The lift table assembly has at least two functions—toprovide a shelf/platform for tooling that acts as a board support toprevent board sagging of the circuit board during printing, and toprovide for moving the tool lift assembly upward, in this sense the lifttool assembly moves the entire circuit board when moving the lift tableassembly.

The lift tool assembly enables minimal interaction of the lift tableassembly and the transport rail member when the lift table assemblymoves up and engages the lift tool assembly. One advantage ofmaintaining the transport rail members stationary in the vertical z-axisdirection is that circuit boards can be loaded and unloaded whilesimultaneously printing a circuit board in the center section, therebyimproving cycle time.

This provision of the lift tool assembly design also allows for modularfunctional options. The lift tool assembly enables a more modular designallowing for standardization in the factory with the possibility ofcustomization at the customer site.

The lift tool assembly is designed to be a self-contained tool thatrides on a main beam which is common to all options provided for thestencil printer. In order to better understand the functionality of thelift tool assembly, the transfer rail members each functions as a beamand the lift tool assembly functions as a tube. The lift tool assemblysurrounds the transfer rail member and rides/rest on top of the transferrail member. As the support surface of the lift table assembly moves upto engage the lift tool assembly, the lift tool assembly no longertouches the transfer rail member on any surface. At this point in theprocess, the lift tool assembly is only referenced to the supportsurface of the lift table assembly by way of the bottom surface of thelift tool assembly. This arrangement eliminates a secondary rail/beamreference by way of linear bearings which may distort or constrain thelift tool assembly resulting in imprecise alignment. After printing iscomplete, the lift table assembly and the lift tool assembly are loweredto position the circuit board back into its neutral transport positionfor unloading out of the stencil printer.

Options for the conveyor system include a lift tool assembly that canaccommodate a passive clamping system or an active clamping system. Twoother options, which are independent of each other and the lift toolassembly, are staging assemblies, which can be attached to the back ofthe transport rail members on the left and/or right sections of therail. The staging assemblies can be combined with optional hard stops aswell.

Embodiments are not limited in their application to the details ofconstruction and the arrangement of components set forth in thefollowing description or illustrated in the drawings. Also, thephraseology and terminology used herein is for the purpose ofdescription and should not be regarded as limiting. The use of“including,” “comprising,” or “having,” “containing,” “involving,” andvariations thereof herein, is meant to encompass the items listedthereafter and equivalents thereof as well as additional items.

Having thus described several aspects of at least one embodiment, it isto be appreciated various alterations, modifications, and improvementswill readily occur to those skilled in the art. Such alterations,modifications, and improvements are intended to be part of thisdisclosure, and are intended to be within the scope of the disclosure.Accordingly, the foregoing description and drawings are by way ofexample only.

What is claimed is:
 1. A method for supporting and clamping a substratein a print position during a print operation of a stencil printer, themethod comprising: moving the substrate on a conveyor system having apair of rails at a transport height over a lift table assembly; clampingopposite edges of the substrate; and moving the substrate in a z-axisdirection with a lift tool assembly coupled to each rail member, whereinfor each rail member, the lift tool assembly is movable with respect tothe rail member, the lift tool assembly being configured to cooperatewith the lift table assembly and to engage and support the substrate ata transport height and a print height, the lift tool assembly includinga lifter portion configured to be engaged by a support of the lift tableassembly and a modular clamping subassembly coupled to the lifterportion, the modular clamping subassembly including a backplane mountedon a top of the lifter portion, the backplane having a linear bearingmounted on a back of the backplane to provide a degree of freedom forclamping.
 2. The method of claim 1, wherein the substrate is configuredto move between a transport height position, a vision system clearanceheight position and a print height position.
 3. The method of claim 2,further comprising locating a pin associated with the lift tool assemblyinto a locator associated with the rail member when moving the substrateto the transport height position.
 4. The method of claim 1, wherein thelifter portion includes a foot that extends under the rail member, thefoot being configured to be engaged by the support of the lift tableassembly.
 5. The method of claim 4, wherein the foot of the lifterportion contains permanent magnets to couple to the support of the lifttable assembly.
 6. The method of claim 1, wherein the modular clampingsubassembly further includes an L-shaped plate mounted on the linearbearing.
 7. The method of claim 6, wherein the L-shaped plate isconfigured with a clamping assembly on which flexible steel foils clampsubstrate.
 8. The method of claim 7, wherein a clamping force on thesubstrate is provided by several pneumatic cylinders.
 9. The method ofclaim 1, wherein the backplane of the modular clamping subassemblyincludes a pin configured to be positioned within a locator associatedwith the rail member.